06.02.19 - 07.02.2019 - European Advanced Technology Workshop on Micropackaging and Thermal Management - CALL FOR PAPERS

Call deadline: 12 October 2018

The workshop will present latest improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.  

Increases in functionality, complexity, miniaturisation, operating temperature and power output require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. 

Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also a greater reliability. These trends also require improvements and changes in packaging and thermal materials.  

Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels.

IMaps Website
Call for Papers

La Rochelle / France