Konferenzen

07.10.19 - 08.10.2019 - ISAPP - International Symposium on Advanced Power Packaging - CALL FOR PAPERS

CALL FOR PAPERS
Abstract deadline: 31. May 2019

This international symposium aims to gather and evaluate all the aspects of science, technology, and business in the fields of the next generation packaging technology and passive components of power electronics especially for wide band gap semiconductors (WBGs) and to review their reliability issues on power electronics applications including electric mobilities such as cars, trains, airplanes, industrial/humanoid robots, IoT, and renewable energies/energy grids. This symposium will bring together key persons from all over the world and from every sector of academy and industry in the field of next generation power electronics.

Main Topics

Packaging Materials

Solders, sinter joining, TLP joining, wiring, ceramic/organic substrates, molding/potting compounds, coating, TIM

ISAPP Website

CALL FOR PAPERS

Veranstaltung:
Symposium

Ort:
Osaka / Japan