Project IsoGap

Area of international cooperation High Temperature Materials and Reliability Testing for WBG Power Electronics
Japanese Projects International Standardization of WBG Thermal Evaluation Method for Ceramic Substrates (ISoTEC) High frequency GaN power module system integration (GaNPack)
German Project High Temperature Conformal Coating for 3D-Integrated WBG Power Modules including Advanced Reliability Testing
Acronym IsoGap
Duration 01.08.2018 – 31.07.2021 (3 Years)
German Funding Federal Ministry of Edication and Research

Contact

Peter Rechberger, M. Sc.
Project Manager
Cluster Internationalization

 

Project IsoGap

Motivation

To fully exploit the potential of WBG Power Semiconductors in automotive applications e.g. for EVs and HEVs a new, highly integrated power module packaging technology is required. Main target is the miniaturization of the power electronic converters which means a significant in-crease in power density and therewith of temperature. This can lead to highly integrated 3D power modules e.g. with double-sided cooling.

The complex structure with gaps and shadowing of the modules on the one side, and the higher temperatures with the related wider temperature swings on the other side, lead to major challenges for the electrical isolation and climate protection. Therefore, advanced passivation, coatings and encapsulation systems have to be developed which will fulfill these requirements. These encapsulation or coating systems have to be optimized for high temperatures (≤ 300°C) and high dielectric strength.

Furthermore, todays reliability tests have to be modified for the higher temperatures and the wider temperature ranges in active and passive temperature cycling as well as in electrochemical humidity and corrosion testing. This will be another focus of the proposed project.

Scope of the project
  • Parylene coating for narrow gaps and 3D structures
  • Comparison of various test structures and treatments
    (cleaning, coating, gap variations, etc.)
  • Reliability testing
  • Application in 3D-Integrated WBG power modules
IsoGap partners in Germany
  • Bavarian Power Electronics Cluster within ECPE e.V.
  • Conti Temic microelectronic GmbH
  • Rogers Germany GmbH
  • Plasma Parylene Systems GmbH
  • Dr. O.K. Wack Chemie GmbH (Zestron)
  • Fraunhofer IISB
  • University of Bremen
Cooperation partners in Japan 
  • Osaka University
  • Japan Fine Ceramics Association
  • Showa Denko
  • Senju Metal Industry
  • Uyemura
  • Nippon Shokubai
  • Yamato Scientific
  • Espec
  • Hitachi Metals

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