To fully exploit the potential of WBG Power Semiconductors in automotive applications e.g. for EVs and HEVs a new, highly integrated power module packaging technology is required. Main target is the miniaturization of the power electronic converters which means a significant in-crease in power density and therewith of temperature. This can lead to highly integrated 3D power modules e.g. with double-sided cooling.
The complex structure with gaps and shadowing of the modules on the one side, and the higher temperatures with the related wider temperature swings on the other side, lead to major challenges for the electrical isolation and climate protection. Therefore, advanced passivation, coatings and encapsulation systems have to be developed which will fulfill these requirements. These encapsulation or coating systems have to be optimized for high temperatures (≤ 300°C) and high dielectric strength.
Furthermore, todays reliability tests have to be modified for the higher temperatures and the wider temperature ranges in active and passive temperature cycling as well as in electrochemical humidity and corrosion testing. This will be another focus of the proposed project.
Scope of the project
Parylene coating for narrow gaps and 3D structures
Comparison of various test structures and treatments (cleaning, coating, gap variations, etc.)
Application in 3D-Integrated WBG power modules
IsoGap partners in Germany
Bavarian Power Electronics Cluster within ECPE e.V.
Conti Temic microelectronic GmbH
Rogers Germany GmbH
Plasma Parylene Systems GmbH
Dr. O.K. Wack Chemie GmbH (Zestron)
University of Bremen
Cooperation partners in Japan
Japan Fine Ceramics Association
Senju Metal Industry
Cluster Leistungselektronik im ECPE e.V. Landgrabenstraße 94 D-90443 Nürnberg, Deutschland Telefon: +49 (0)911 81 02 88-0