| Area of international cooperation | High Temperature Materials and Reliability Testing for WBG Power Electronics |
| Japanese Projects | International Standardization of WBG Thermal Evaluation Method for Ceramic Substrates (ISoTEC) High frequency GaN power module system integration (GaNPack) |
| German Project | High Temperature Conformal Coating for 3D-Integrated WBG Power Modules including Advanced Reliability Testing |
| Acronym | IsoGap |
| Duration | 01.08.2018 – 31.10.2021 (3 Years, plus 3 months extension due to Covid) |
| German Funding | Federal Ministry of Edication and Research |
Contact
Peter Rechberger, M. Sc.
Project Coordination
Head of Cluster-Internationalization
To fully exploit the potential of WBG Power Semiconductors in automotive applications e.g. for EVs and HEVs a new, highly integrated power module packaging technology is required. Main target is the miniaturization of the power electronic converters which means a significant in-crease in power density and therewith of temperature. This can lead to highly integrated 3D power modules e.g. with double-sided cooling.
The complex structure with gaps and shadowing of the modules on the one side, and the higher temperatures with the related wider temperature swings on the other side, lead to major challenges for the electrical isolation and climate protection. Therefore, advanced passivation, coatings and encapsulation systems have to be developed which will fulfill these requirements. These encapsulation or coating systems have to be optimized for high temperatures (≤ 300°C) and high dielectric strength.
Furthermore, todays reliability tests have to be modified for the higher temperatures and the wider temperature ranges in active and passive temperature cycling as well as in electrochemical humidity and corrosion testing. This will be another focus of the proposed project.
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