Leistungselektronik-Kolloquium in Kooperation mit dem Cluster Leistungselektronik

Die Teilnahme ist kostenfrei und offen für alle Interessierten. Eine Voranmeldung ist nicht erforderlich.

Beginn: 17:15 Uhr
 

Am MS-TEAMS Meeting teilnehmen

Rechtliche Hinweise


 

• Introduction to the Joint Lab
  Dr. Michael Jank, Fraunhofer IISB, Erlangen, Germany
  
  IISB offers an ideal ecosystem for deployment of the SST Vacuum Reflow System. Various surface conditioning and solder deposition techniques allow for a reproducible preparation of the joining partners before starting the process. The bond quality can be analyzed by mechanical, thermal, acoustic, (electron) optical and/or electrical means to acquire a deeper understanding of the process and its crucial parameters. Application-relevant integration is achieved by top contact formation and encapsulation.

• Successful Void-Free Die Attach using Vacuum Reflow Systems
  Martyn Davies, David Taylor, Gonzalo Esparza, Palomar Technologies, Paignton, England
  
  The presentation gives an introduction to Palomar Technologies and summarizes the market drivers for vacuum reflow systems. After giving general considerations for void-free die attach the benefits of vacuum reflow systems in achieving void-free die attach are discussed.

Palomar Technologies GmbH and Fraunhofer IISB are collaborating in the field of advanced soldering technologies. The joint efforts are centered around the SST Vacuum Reflow Systems 8300 Series Automated Vacuum/Pressure Soldering equipment that is perfectly integrating into the IISB laboratory for Assembly and Interconnect Technologies (AIT). Accompanying the soldering device, users find the entire value chain from surface and preform/paste handling via die placement, top-side interconnect and potting/encapsulation. Related analytical technologies like Scanning Acoustic Microscopy and Focused Ion Beam offer ideal capabilities for process analysis and optimization. The ecosystem is completed by reliability testing according to Automotive Quality Guideline AQG 324.

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Next planned date:
Monday, 16th of May 2022 – 17:15 ONLINE

Themenschwerpunkt:  YesVGaN Power

“GaN Power at Silicon cost – The European YesvGaN project”, Elke Meissner, Fraunhofer IISB)

“Modeling and experimental validation of wafer curvature during growth of thick GaN layers on large Si(111) substrates for vertical power devices”
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