Thermal engineering of power electronic systems is a key to achieve high performance and reliability. With a clear focus on power modules the tutorial addresses the thermal design and validation of power electronic components exemplified by a 100kW IGBT converter equipped with additional thermal sensors. The attendees should have basic knowledge on power semiconductor devices and power electronics systems.

Part 1: After a review of the basic theory of heat transfer, the calculation of losses in a voltage source inverter will be explained. For selected stationary operating conditions, the losses and device temperatures of the sample converter will be calculated from datasheet values, demonstrating the functionality of modern online tools provided by module manufacturers. Participants can choose between FEM simulations and equivalent thermal network calculation with LTspice™ to simulate device temperatures for defined losses, when system geometry and material layers are known. A 3rd practical training group will deal with the comparison of a simulated power board with measurement and calibrate afterwards the simulation model.

Part 2: Following a summary of the results of part 1, failure mechanisms, at both the semiconductor and package levels, will be introduced. After that, thermo-/damage-sensitive parameters will be discussed, along with the theoretical background of thermal impedance measurement. A practical demonstration of thermal impedance measurement with only standard laboratory equipment will conclude the first day. The second day will start with concrete design for reliability concepts, then aim straight at lifetime estimation, based on both power cycling and mission-profile approaches. Advanced electro-thermal and thermo-mechanical simulation will follow, and an overview of cooling systems and TIM materials will conclude the 2-day tutorial.

All presentations and discussions will be in English language.

Part 2: Thermal Management and Reliability