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ECPE Young Engineer Award at CIPS Conference

Since 2008, ECPE sponsors one of the three Young Engineer Awards at PCIM Europe. They are presented to exceptional contributions from young professionals. The winners are invited to present their paper at the PCIM Europe Conference, receive prize money and see their paper published in the conference proceedings.

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Sabrina Haberl
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2018

2018

The winner of the Young Engineer Award at CIPS Conference 2018 sponsored by ECPE is:

  • Christina DiMarino (Center of Power Electronic Systems (CPES)): Her paper is about 'Fabrication and Characterization of a High-Power- Density, Planar 10 kV SiC MOSFET Power Modulea'. 
  • 2016

    The winner of the Young Engineer Award at CIPS Conference 2016 sponsored by ECPE is:
     

    • Daniel Kearney (ABB Corporate Research Centre & ABB Schweiz AG)
      'PCB Embedded Power Electronics for Low Voltage Applications'

     

     

  • 2014

    The Young Engineer Award at CIPS Conference 2014 sponsored by ECPE was split between two winners:

    • Bianca Böttge (Fraunhofer IWM)
      'High Resolution failure analysis of silver-sintered contact interfaces for power electronics'
       
    • Dr. Christian R. Müller (Infineon)
      'Low-inductive Inverter concept by 200A/1200V half bridge in EasyPack 2B – following strip-line design'. 
  • 2012

    The winners of the Young Engineer Award at CIPS Conference 2012 sponsored by ECPE are:

    • Silke Kraft (Fraunhofer IISB)
      'Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications'.
       
    • Gernot J. Riedel (ABB Switzerland Corporate Research)
      'Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modelling and Experimental Results'.
  • 2010

    The winner of the Young Engineer Award at CIPS Conference 2010 sponsored by ECPE is :

    • Jens Göhre (Fraunhofer IZM)
      'Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling Measured by the Shear Test'.

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